Physics of Failure & DfRQ Library Includes: Junction Temperature Analysis, CTE Mismatch Assessment of Materials, BGA Solder Join Shear Strain Assessment, Wire Bond Subject to Vibration & Shock Assessment,  Packaging Guidelines for Foam Thickness to Protect from Drop Shock, Circuit Board Component Fatigue Life (Steinberg) Assessment, Fatigue Life Estimation Using Miner's Rule, Gold Embrittlement, Purple Plague/Kirkendall Voids Test, Black Pad ENIG Information, Silver Migration Testing, Corrosion Analysis Help and more...